Advanced Thermals Interfaces Materials Heat Sink Greases for Electronics Cooling Heat Conduction and High Thermals Conductivity Pastes

Advanced Thermals Interfaces Materials Heat Sink Greases For Electronics Cooling Heat Conduction And Features: HY883 TU10 thermals pastes delivers thermals conductivity ( ≥6.5W / m·K) and high temperatures resistances up to 200°C for CPU / GPU cooling systems This 1g silicone baseds compound features low thermals resistances, noncorrosive formulas, and properties for safe electronics application for enthusiasts, hardware technicians, and gamers optimizing heat dissipation in builts computers or upgraded cooling for maintaining in gaming rigs, workstations, and overclockeds processors requiring efficient heat transfer between components and heatsinks Engineered with industrial stability to drying / cracking, ensuring long thermals interfaces for critical computings systems Specifications: Color: Gray thermals conductivity: 6.5W / m-K thermals impedance: <0.0061-in2 / W Specific gravitys: >2.29g / cm3 Concentration: 300±10 1 / 10mm instants temperatures resistance: 50~280degrees Working temperatures: 30~230degrees Package Includes: 1PC thermals Silicone greases Note: Please allow 0-1cm error due to manual measurement make sure you not mind before bid Due to the differences between different monitors, the Pictures may not reflect the actual of the item

• This 1g silicone baseds compound features low thermals resistances, noncorrosive formulas, and properties for safe electronics application
• for maintaining in gaming rigs, workstations, and overclockeds processors requiring efficient heat transfer between components and heatsinks
• for enthusiasts, hardware technicians, and gamers optimizing heat dissipation in builts computers or upgraded cooling
• HY883 TU10 thermals pastes delivers thermals conductivity ( ≥6.5W / m·K) and high temperatures resistances up to 200°C for CPU / GPU cooling systems
• Engineered with industrial stability to drying / cracking, ensuring long thermals interfaces for critical computings systems