Amaoe PD-C magnetic suction kit.Magnet base+Pd-C Planting Tin Pad for Mobile Phones Repair CPU Chip Ic Steel Mesh High Temperature Thermal Insulation Silicone Pad。PD-C repair pad.2pcs of blades.

The Amaoe PD-C magnetic suction kit is a professional-grade solution for mobile phone repair technicians working with BGA chips. This comprehensive kit includes a magnetic base, PD-C planting tin pad, and two precision blades for efficient chip repairs on both Suitable for Apple & Android devices. The innovative steel mesh magnetic leveling system keeps components firmly in place during soldering, allowing hands-free operation for more precise work. Its thoughtfully engineered slope design ensures superior compatibility with thin IC chips, preventing solder pad suspension and promoting even distribution. The kit excels at handling chips less than 0.9mm thick, making it ideal for most modern mobile phone repairs. The high-temperature thermal insulation silicone pad provides essential protection during delicate soldering operations. This specialized tool combines practicality with precision, offering mobile repair professionals the control and stability needed for successful BGA chip installations.

• MAGNETIC POSITIONING: Steel mesh magnetic leveling system keeps the pad stable during tin scraping, allowing hands-free operation for more uniform results
• COMPATIBILITY: Suitable for BGA chip soldering on both Suitable for Apple and Android phones, specifically designed for chips less than 0.9mm thick
• SLOPE DESIGN: Innovative angled construction ensures better chip compatibility and prevents solder pad suspension for even distribution
• KIT CONTENTS: Complete set including magnetic base, PD-C planting tin pad, and 2 precision blades for mobile phone CPU chip repair
• THERMAL FEATURES: High-temperature resistant silicone pad with steel mesh construction for reliable chip IC repair operations