PI Foam Sheet, Polyimide Flexible High-Temperature Resistant Insulating Lithium Battery Research Material, Semi-Solid Cell Pi Foam Plate (2 * 100 * 100mm T*W*L)

Polyimide has a light yellow appearance. Its flexural strength (at 20℃) is ≥170MPa, density is 6.5 to 500/cm ³, tensile strength is ≥100 MPa, and Vicat softening point is 270℃ PI foam features high-temperature resistance, self-lubrication and low wear. It has excellent mechanical properties, good dimensional stability, a small coefficient of thermal expansion, high insulation and low thermal conductivity. It can replace metal, ceramic and high-temperature polymer materials in many cases Due to its outstanding high-temperature resistance, dielectric properties and excellent radiation resistance, special polyimide, as a functional material, can be widely used in the microelectronics industry Special engineering plastics: Due to the excellent properties of special polyimide such as high temperature resistance, high strength and wear resistance, it can be used as high-temperature resistant materials in high-temperature resistance of aluminum alloys, titanium alloys, stainless steels and ceramics in high and low temperature environments PI resin is an engineering plastic with high modulus, high strength, excellent insulation and heat oxidation resistance. It is widely used in aerospace, electrical insulation, industry and other precision machinery fields

• Polyimide has a light yellow appearance. Its flexural strength (at 20℃) is ≥170MPa, density is 6.5 to 500/cm ³, tensile strength is ≥100 MPa, and Vicat softening point is 270℃
• PI foam features high-temperature resistance, self-lubrication and low wear. It has excellent mechanical properties, good dimensional stability, a small coefficient of thermal expansion, high insulation and low thermal conductivity. It can replace metal, ceramic and high-temperature polymer materials in many cases
• Due to its outstanding high-temperature resistance, dielectric properties and excellent radiation resistance, special polyimide, as a functional material, can be widely used in the microelectronics industry
• Special engineering plastics: Due to the excellent properties of special polyimide such as high temperature resistance, high strength and wear resistance, it can be used as high-temperature resistant materials in high-temperature resistance of aluminum alloys, titanium alloys, stainless steels and ceramics in high and low temperature environments
• PI resin is an engineering plastic with high modulus, high strength, excellent insulation and heat oxidation resistance. It is widely used in aerospace, electrical insulation, industry and other precision machinery fields